AEC Exhibitor Highlights from Autodesk University 2009

Last month, we looked at the highlights of the general session keynote and the AEC industry keynote and Design Computation Symposium of Autodesk University 2009, held in Las Vegas in early December. This article provides an overview of the AEC-related applications that were on display at the Exhibit Hall at Autodesk University, where over 120 exhibitors were showing hardware and software solutions that work with Autodesk products. These include several design visualization solutions such as 3D digital holograms from Zebra Imaging that provide a whole new way of visualizing and presenting designs to clients, a new 3D real time exploration and navigation solution called Nova that works with Revit models, and several new 3D printing devices. The number of supporting technologies extending the capabilities of BIM that were exhibited includes "regulars" such as Trelligence, e-SPECS, IES, CADworks, and Solibri, as well as new solutions such as Vela Systems' "Field BIM" applications and Revit productivity add-ons from Integrated Content Solutions. We also had vendors such as BSD unveiling new BIM-integrated versions of their applications. In addition, there were a large number of engineering solutions on display, including structural engineering solutions from Strucsoft Solutions and CSC, and civil and site engineering solutions from Sivan Design, Transoft Solutions, and SITEOPS. Let’s take a brief look at each one of these products.

Design Visualization Solutions

The new holographic technology by Zebra Imaging that was displayed at Autodesk University was amazing and quite unlike anything I had even seen before. It allows highly detailed and photorealistic 3D models of buildings in various CAD formats to be captured in a digital hologram on a sheet that is only slightly thicker than a posterboard, making it very easy to store. At the Zebra Imaging booth, a whole stack of these holograms were being displayed, and it was fascinating to see the 3D models literally popping out of each sheet as it was unveiled. You almost reach out to touch it with the expectation that you can, but there’s nothing there except air. You can, however, move around the image to view it from a wide variety of angles. No special glasses or other viewing aids are needed. I found these 3D digital holograms an intriguing new visualization tool. While they are certainly more expensive to create than simply visualizing a 3D model of a design on the computer, I can see them potentially being used as an occasional alternative to 3D printing for better understanding and presentation of a design concept to a client. Currently, the ability to produce a digital hologram is only available through companies like Zebra Imaging, as the machines that make these are in the million dollar range. However, it is possible that as the technology evolves, the machines will get more affordable and AEC firms could even think of buying their own and make holograms a common way to visualize and present design concepts. It would be similar to how 3D printing has become much more commonplace and affordable now compared to a decade ago, when the technology was still new and prohibitively expensive.

At last year’s Autodesk University, there were two new model visualization solutions for Revit being exhibited, ICEvision and VEO-LUX (see the article, AEC Exhibitor Highlights from Autodesk University 2008).  Neither of these were back this year, although they still seem to be around. There was however, another similar solution being exhibited this year, Nova, which is also new and is developed by a French company called Vertice. Nova is a real time 3D solution which allows high quality and interactive 3D scenes to be created and navigated as easily as in a video game. It includes exporters for Revit and 3ds Max, allowing models created with these applications to be exported to the Nova Explorer application for interactive viewing. There are options to choose between different rendering modes, selecting the object categories for collision management, configuring objects to be interactive, and setting up other special effects. As shown in Figure 1, the image quality is excellent for an interactive viewer. In addition to visualizing projects, the application can be used to make high-resolution screenshots, videos, and independent self-executable files, as well as files for online viewing. The product range also includes a server rendering solution which allows Nova files to be uploaded online and provides users with the capability to visualize, explore, and interact with the 3D models in a real time environment using just a browser, with no need for plug-ins or any other file downloads.

There was a marked increase in the number of 3D printing solutions that were exhibited at Autodesk University this year. Industry leader Z Corporation showed its new premium composite build material—its strongest ever—called zp150 that creates stronger 3D models with higher resolution, richer colors, and brighter whites. The zp150 was released in June for the ZPrinter 450 and ZPrinter 650 3D printers, and is also compatible with the ZPrinter 310 Plus and Spectrum Z510 3D printers, as well as the new entry-level, low-cost monochromatic 3D printer, ZPrinter 350, that was released in October. In addition to the benefits of strength and color, the new material allows water to be used as the curing agent for finishing multicolor models. Water curing is the simplest, most affordable, safest and greenest post-processing method in the 3D printing industry today, especially suited for early prototypes and education environments.

Other 3D printing solutions that were exhibited include Dimension 3D printers from Stratasys that use ABS plastic as the source material and create 3D models from the bottom up, one layer at a time (see Figure 2). STL files are imported into the software application that comes with the printers, which automatically slices and orients the parts and creates any necessary support structures. The material, which comes in filament form, is heated to a semi-liquid state and deposited in thin layers by an extrusion head. The support structures are removed after the model has finished printing. There are four kinds of printers with different features and pricing. The smallest, called uPrint, costs $14,900 and is small enough to fit on a desktop!

In addition to the ones from Z Corp and Stratasys, other 3D printing solutions on display included Ultra from EnvisionTec, and Eden350 from Objet. There were also 3D printing service providers such as Impact 3D Models, which sets up on-site 3D printing services for firms in addition to custom 3D printing and training and support services.

Supporting Tools Extending the Capabilities of BIM

A regular exhibitor at Autodesk University, Trelligence showed some updates to its space programming and schematic design application, Affinity, since I last saw it at the AIA 2009 National Convention. Trelligence Affinity includes bi-directional integration with key design applications including Revit Architecture 2010, ArchiCAD 12, and SketchUp Pro 7. The updates demonstrated at Autodesk University showed how it is continuing to improve upon its Revit integration. A key new feature is the ability to automatically generate Affinity Template room objects from existing Revit families. Users can select which Revit families to generate during synchronization, ensuring that Affinity object libraries fully match, without any manual intervention. There are also new options that provide greater control over synchronization of multiple linked Revit files with a single Affinity project file, allowing Affinity to be more effectively used even on large projects such as campuses that typically use model linking in Revit. Other enhancements include the ability to create more complex reports that include a variety of items and formats such as tables, images, lists, etc., as well as fully customized headers and footers; improvements to room label formatting including content editing, wrapping, and new scaling capabilities; and additional background image color depth control, ranging from 75 to 300 dpi.

InterSpec was also back at Autodesk University to show the upcoming release of its CAD and BIM-integrated specifications solution, e-SPECS. The new version, 5.0, builds upon the enhancements in version 4.2 that were briefly described in my article on the AIA 2009 Convention. It includes new specification editing functionality, more advanced reporting, more BIM integration, and additional Building Product Manufacturer (BPM) BIM content. A new BIM Model Validation Console helps designers verify how the objects used in their model will be specified and allows changes to be made directly to the families’ parameters (see Figure 3). New Outline reports are provided directly in Revit for use throughout the design process. There is support for Omni-Class parameters, and over 100 new e-SPECS bindings are included for improved “out of the box” integration. Another critical improvement is the new Section History report, which shows whether sections have been inserted into the project manually through BIM integration, the e-SPECS Checklist, imported consultant sections, or included through the default client account bindings. This can help firms to better differentiate between what sections the model has produced versus what sections were included from other sources. InterSpec is also encouraging Building Product Manufacturers to join its BPM Program that was introduced in e-SPECS 4.2 by providing them with more avenues to get specified into projects, such as distributing their specs directly to specifiers’ desktops, automating the inclusion of their specification when their Revit families are included in a project model, and promoting those BPMs who are already listed in the specifications. 

Another developer of specifications software, Building Systems Design, Inc. (BSD), used Autodesk University to launch a new release of its popular BSD SpecLink+ application. Rechristened as BSD SpecLink-E, the new release has been developed to integrate with all the disciplinary Revit applications, so that the model can be used to jump-start the specifications process. The integration happens through a brand new linking product called LinkMan-E that BSD has developed from the ground up to work with SpecLink-E, to act as a communications conduit and an integration manager (see Figure 4). Currently in final beta testing with release set for March, LinkMan-E can be used by a project manager to review and coordinate data on the same project from all connected applications. Dashboard views show the status of objects in each of the linked applications, and it can also be set to "turn on" any missing products in the SpecLink-E application, based on data from Revit. In addition to BIM integration, SpecLink-E has been enhanced with many new features including the ability to collapse or expand the database to produce outline, short form, and full construction specs without the need to maintain separate documents for various phases of a project or start over. It also allows real-time updating of its master database over the Internet at any convenient time as well as automatic updates of individual client software on each user's computer from a central location on the network. BSD is also working on developing integration between its cost estimating product, BSD CostLink/AE, and Revit using LinkMan-E. It expects to release the new version of BSD CostLink/AE with the integration capability later this year.

There were several additional solutions and services related to BIM objects and content. Integrated Content Solutions, a new venture started by CAD Technology Center, a leading Minneapolis-based Autodesk reseller that specializes in the AEC market, showed a number of productivity-enhancing Revit add-on applications including SuperDoor, a Revit family that allows users to generate virtually infinite variations of panel and frame configurations; CubeTracker, which allows any configurable parameter within Revit to be driven from a spreadsheet; WaterMark, which embeds identifying characters into Revit families that cannot be removed, allowing users to prevent unauthorized use of their content; and converters that can extract AutoCAD and MicroStation files directly from Revit. Reed Construction Data, developer of the RSMeans cost database and related products, showed the updates to its SmartBIM product line-up including SmartBIM Objects, which are high-quality parametric content for Revit, both generic and manufacturer-specific; SmartBIM Spaces, which include pre-built collections of objects for various kinds of spaces in different building types; SmartBIM Library, a management tool that simplifies storage, organization and location of Revit objects; and SmartBIM QTO, a tool that provides early cost estimation for Revit projects, powered by RSMeans. CADworks was also back to show its updated offerings for users of Revit MEP, including over eight thousand manufacturer MEP-specific objects; productivity tools include conduit types, pipe and fitting types, and other Revit MEP routines; and WebAxis, a subscription-based content delivery and collaboration portal based on Microsoft’s SharePoint technology.

For energy analysis, in addition to Autodesk’s in-house Ecotect and GreenBuildingStudio applications, another regular exhibitor, IES, was at hand to demonstrate its VE-Toolkits for early design analysis and the VE-Gaia application it launched at the AIA 2009 show (see Sustainable Design Tools Exhibited at AIA 2009 for a brief overview of VE-Gaia). IES also used Autodesk University as an opportunity to unveil the second generation of its Revit Plug-in, which includes enhanced model transfer capabilities. It can handle more challenging and complex geometry such as highly detailed curtain walling systems, multi-faceted shading surfaces and mullions, and additional complex shapes and junctions. It also allows users to choose the level of detail with which the model is exported from Revit; there a range of options from the basic, to how shading surfaces are handled, to whether curtain wall mullions are counted as shading surfaces. This provides users with more control over the energy modeling and analysis and can be used to reduce the complexity of models to reduce simulation times, if required.

Moving on to model checking, Solibri showed an updated version 5.1 of Solibri Model Checker (see my review of version 5.0 published in March 2009). The new version provides tools for spatial coordination, enabling the building industry to move from construction phase on-site collision removal and design phase collision detection—which the more common interference-checking tools focus on—to a more coordinated design of space usage. It allows the design team to focus on improving design quality by checking for compliance with owner specifications, and efficiently and effectively managing any issues that are identified. Another key improvement is the ability to import DWG files in addition to the IFC files that Solibri Model Checker has been restricted to until now.  This is very helpful as it opens up the use of model-checking to all those disciplines and trades whose applications do not yet export IFC files.

I also had the opportunity to learn more about Vela Systems “Field BIM” technology, which is relatively new and was being exhibited at Autodesk University for the first time. Vela Systems develops a range of construction field software focused specifically on field operations. It runs on Tablet PCs and is intended to streamline and accelerate the field administration process by replacing traditional field notebooks, paper plans and clipboards. The software suite covers tasks such as materials tracking, work lists, punch lists, field report, quality control and quality assurance, and commissioning. Field BIM refers to the bi-directional integration that Vela Systems has developed with applications such as Autodesk NavisWorks and Tekla Structures, so that the usefulness of the information created in a BIM model can be brought into the Vela Systems software and used for the different field processes. For example, if Vela is to be used with NavisWorks for commissioning an HVAC system, all the components making up the system can be grouped in NavisWorks and brought into Vela through a configuration process. Subsequently, the commissioning information added in Vela can be sent back into NavisWorks, allowing it be reviewed and stored for the lifetime of the building (see Figure 5). Construction teams can benefit from time savings as well as the accuracy and efficiency enabled by BIM, while owners can benefit from BIM handover models that are updated with field information.

Engineering Solutions

I noticed a marked increase in the number of structural and civil engineering solutions being exhibited at Autodesk University this year. Strucsoft Solutions, a developer of structural steel and wood framing solutions for Revit, used the show to introduce its new MWF (Metal Wood Framer) application. It is the first wall panelizer running on the Revit platform for wood and light gauge metal construction (see Figure 6). Based on rules, MWF is a template driven application that recognizes Revit walls, doors, windows and openings, based on which it models panel stud arrangements, internal and external sheathing, bearing beams, and internal and external bracing, taking into account user defined preferences. It automatically assigns panel numbering and shape labeling, and also generates shop drawings, cut list and CNC output.

Another structural engineering solutions exhibitor was CSC, which showed its wide software portfolio for structural engineers including products such as Fastrak Building Designer and Fastrak Portal Designer for structural steelwork design and analysis; Orion for reinforced concrete analysis and design; S-Frame for analyses ranging from entry-level 2D elastic analysis to sophisticated 3D non-linear finite element analysis; TEDDS, a comprehensive and easy to use calculation pad for professional engineers; FabTrol for steel fabrication, estimating, and production control; and 3D+ , an AutoCAD based structural modeling software that provides automated general arrangement drawings, material lists and revision history and integrates with all of CSC's design applications.

On the civil engineering front, Sivan Design unveiled the 2010 version of its CivilCAD Solution Suite which offers road planning and design, upper and underground infrastructure design and pipes layout tools, earthworks calculations, and cross platforms surveying data handling capabilities. The company also showed the new version of its Civil Simulate application, which can be used to quickly turn any AutoCAD Civil 3D or CivilCAD project into a 3D interactive simulation, allowing civil engineers to get a better understanding of their designs and the surrounding context (see Figure 7). Introduced at last year’s Autodesk University, the updated version of Civil Simulate includes intelligent automatic intersections and junctions modeling, the ability to derive accurate 3D measurements between any two points in the simulation, and the ability to assess and highlight critical points that can be referred to later in the design environment. A free viewer is available for navigating the 3D simulation, allowing firms to share flyover movies and scenario visualizations with clients. Transoft Solutions, which had earlier exhibited at the AIA 2009 show, was also at Autodesk University this year, showing two of the latest products from its extensive software suite for site design and civil engineering: SIGMA, an application for creating and placing traffic sign assemblies into roadway drawings; and TORUS, which allows engineers to design optimal roundabouts that meet traffic operations and safety objectives.

I was pleasantly surprised to find SITEOPS exhibiting at Autodesk University for the first time. While the application is very familiar to me (see my article from March 2008, SITEOPS: Applying Optimization Technology to Site Design), I think it is important for AEC professionals to become better aware of applications like SITEOPS that have actually been using optimization technology for some time now to solve real-world design problems, as opposed to Autodesk, which talked a lot about optimization in its keynotes at Autodesk University, but has not yet demonstrated it in any of its applications (see the Analysis and Conclusions sections of my articles on the general session and AEC keynote). SITEOPS applies optimization technology to site design, using remote servers to calculate and provide an optimal solution for a building layout, roads, and parking on the site, as well as site grading and storm water drainage. It uses an on-demand, Software-as-a-Service (SaaS) Internet-based delivery model. Previously available only as a Single Pad version that could work with a single building footprint on a site, SITEOPS is now available also as a Multi Pad version that can handle sites with multiple building footprints. The application can be used by land developers, retailers, architects and civil engineers to quickly produce site layout options and cost reports, enabling them to identify significant savings for commercial and retail properties.

Conclusions

The solutions described in this article are by no means an exhaustive listing of all the AEC-related applications exhibited at Autodesk University. Others that I did not get a chance to cover here include hardware offerings from vendors such as Nvidia, HP, and 3Dconnexion, collaboration solutions such as Riverbed and GlobalSCAPE, and facilities management solutions such as ArchiBUS and CADapult FM that have some form of Revit integration. As always, the Exhibit Hall was a reflection of the pulse of the AEC technology industry and that seemed very much alive and well, despite the widespread economic downturn and the reduced number of attendees at the event. It was heartening to see that companies are continuing to innovate, pushing the state of the art of the AEC industry forward. This growing and vibrant community of third-party developers is also very beneficial for Autodesk, as they contribute enormously towards extending the capabilities of its own products and making them more successful.

About the Author

Lachmi Khemlani is founder and editor of AECbytes. She has a Ph.D. in Architecture from UC Berkeley, specializing in intelligent building modeling, and consults and writes on AEC technology. She can be reached at lachmi@aecbytes.com.

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